| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J169-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-1565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00 |
| filingDate |
2004-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b70755ccfa1f55d2f8fccb81813828a0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c8f2717a2ad284a74d6a8f7f268672f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e059fdf85cd85e0d089152da7fe6c87f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55977860f46faa2508b917fbc4406e65 |
| publicationDate |
2005-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2005307052-A |
| titleOfInvention |
Heat resistant resin composition, adhesive film using the same, and polyimide film with adhesive |
| abstract |
PROBLEM TO BE SOLVED: To provide a heat resistant resin composition having sufficiently excellent adhesiveness even on a low roughened copper foil surface. The heat resistant resin composition of the present invention comprises a heat resistant resin and a general formula (1): [Chemical 1] [In Formula (1), R < 1 >, R < 2 > and R < 3 > show a hydrogen atom or a C1-C10 alkyl group each independently. And a compound having a group represented by the formula: [Selection figure] None |
| priorityDate |
2004-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |