| abstract |
PROBLEM TO BE SOLVED: To uniformly heat only one chip or a plurality of chips while measuring the electrical characteristics of a large number of chips formed on a large-area wafer, and allow other chips to stand by with a temperature lowered as much as possible. A semiconductor heating device is provided. A semiconductor heating apparatus according to the present invention includes a heating unit that mounts and heats an object to be processed, a support unit that supports the heating unit, and a cooling module that contacts the support unit. To do. It is preferable that a plurality of the heating units and the support units are combined, and the workpiece mounting surfaces of the plurality of heating units constitute the same plane. Moreover, it is preferable to arrange | position a heat insulating material under the said support part. The heating part is preferably a ceramic heater. [Selection] Figure 1 |