| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2c5561203784cbc604a4f34191a88204 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40 |
| filingDate |
2004-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ffd226dfc6a7b96b7516b530722fde3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d0a2691447eb7c02b832759bd80d48f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_03d15ffbac6280c464b23bff2c5b11ef |
| publicationDate |
2005-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2005290415-A |
| titleOfInvention |
Electroless copper plating solution |
| abstract |
A stabilizer for electroless copper plating comprising a highly safe substance capable of imparting good stability to an electroless copper plating solution without degrading the properties of the formed electroless copper plating film. I will provide a. The following general formula: [Chemical 1] (Wherein R 1 , R 2 and R 3 are the same or different and have a monovalent aliphatic hydrocarbon group which may have a substituent, an aryl group which may have a substituent, or a substituent. An electroless copper plating solution characterized by containing a phosphine compound represented by the following formula as a stabilizer. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7228411-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020143332-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20220094157-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3156517-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023103293-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111663123-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10975475-B2 |
| priorityDate |
2004-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |