http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005281582-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5415 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-37 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2004-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b00ac5c6f0882671cb07585e4ee619f9 |
| publicationDate | 2005-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2005281582-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To have excellent properties in adhesion to various substrates such as semiconductor elements and lead frames, particularly adhesion to preplating frames such as Ni, Ni-Pd, Ni-Pd-Au, etc. To provide an epoxy resin composition for encapsulating a semiconductor, which has excellent characteristics of solder resistance that does not cause cracks or peeling from a substrate in a semiconductor device even during soldering. SOLUTION: (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler, (E) a triazole compound, and (F) a silicone represented by the general formula (1) An epoxy resin composition for encapsulating a semiconductor, comprising oil as an essential component. [Chemical 1] |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113614141-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020195883-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006143952-A |
| priorityDate | 2004-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 51.