http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005277277-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be055db3c1a09879df07379ba969e223 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2004-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fe69e2f1e8413375a6880c576f9ae996 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_53406e0f6fc87051c3b81c21e48b645e |
| publicationDate | 2005-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2005277277-A |
| titleOfInvention | Manufacturing method of electronic component mounting structure |
| abstract | An object of the present invention is to provide a method for manufacturing a structure for mounting an electronic component capable of easily forming a connection pad at a low cost even with a fine pitch. A solution 4 containing a conductive polymer is transferred and applied from a roller 1 to which the solution 4 is adhered to at least a surface of a substrate 2 having a plurality of electrode terminals formed on the surface, and the solution 4 is applied onto the electrode terminals. It consists of a method of selectively forming connection pads made of a conductive polymer on electrode terminals by agglomeration and fixation by a dewetting method. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7923293-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008258611-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015004979-A |
| priorityDate | 2004-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 43.