| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 |
| filingDate |
2004-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8709a097518c12ecb0a448f2fc984b92 |
| publicationDate |
2005-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2005276971-A |
| titleOfInvention |
Adhesive film for semiconductor with dicing sheet function, method for manufacturing semiconductor device using the same, and semiconductor device |
| abstract |
PROBLEM TO BE SOLVED: To provide an adhesive film for a semiconductor with a dicing sheet function in which an adhesive layer is laminated only on a portion to be bonded to a wafer. A pressure-sensitive adhesive layer 4 is formed on a base film 5 and a film-like adhesive layer 3 is formed on the pressure-sensitive adhesive layer 4. The outer diameter of the adhesive layer 3 is outside the portion to be attached to the wafer 1. It is an adhesive film for a semiconductor with a dicing sheet function that is larger than the diameter and smaller than the inner diameter of the portion to be attached to the wafer ring, and the glass transition temperature of the resin composition constituting the adhesive layer 3 is −30 ° C. or more and 60 ° C. or less. preferable. [Selection] Figure 2 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4905352-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012099826-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7804156-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008108828-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008277806-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012052269-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014154704-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2007129711-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010074115-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010074114-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009044566-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010287848-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008192945-A |
| priorityDate |
2004-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |