http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005276693-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J1-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J9-02 |
| filingDate | 2004-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6b754dbca3cdc534f6d19efb1a81f1b4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_73a0686b0a7abc3d0192b5e0389c73e8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_650a4a5b62d6b5a71dd3268fc495167f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb9a0624a7e0989772007f914647d669 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4ace3e6314d2fe62ff3ebc5cda4570b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_09bc2f25e2c3d65f303dea3f7bc68ab9 |
| publicationDate | 2005-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2005276693-A |
| titleOfInvention | Electron source and manufacturing method thereof |
| abstract | The present invention provides an electron source and a method of manufacturing the same that can prevent bus wiring or disconnection between the bus wiring and a surface electrode under the influence of heat treatment. In an electron source, a plurality of lower wirings are formed on one surface side of an insulating substrate, and a surface electrode is formed on a strong electric field drift layer formed so as to cover the lower wiring. An insulating layer 8 having an opening is formed, and a bus wiring 25 to which a plurality of surface electrodes 7 arranged in a direction intersecting with the lower wiring 12 a are connected is formed on the insulating layer 8. The bus wiring 25 includes a low-resistance metal film 23a patterned for the bus wiring 25 and a refractory conductor film 24a formed so as to cover the low-resistance metal film 23a, and extends continuously from the surface electrode 7. A part of the connected wiring 16 is laminated on the high melting point conductor film 24a. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014041714-A1 |
| priorityDate | 2004-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 51.