| abstract |
PROBLEM TO BE SOLVED: To provide a highly heat-soluble soluble polyimide that can be used for a flexible printed circuit board, a built-up board and the like and can be formed at a low temperature. SOLUTION: Soluble polyimide obtained from 2,3,3 ', 4'-oxydiphthalic anhydride and acid dianhydride mixture essentially comprising 3,4,3', 4'-oxydiphthalic anhydride and diamine . [Selection figure] None |