http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005272487-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3477 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L67-06 |
filingDate | 2004-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e89e7af9d03263106eb42f85b0a09a92 |
publicationDate | 2005-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2005272487-A |
titleOfInvention | Unsaturated polyester resin molding material and unsaturated polyester resin molding product |
abstract | PROBLEM TO BE SOLVED: To maintain copper adhesiveness while maintaining the excellent mechanical and electrical properties of unsaturated polyester resin as compared with a conventional unsaturated polyester resin molding material containing an inorganic filler containing glass fiber. An improved unsaturated polyester resin molding material and a molded article thereof are provided. SOLUTION: It contains an unsaturated polyester resin, a melamine or a melamine derivative, and an inorganic filler containing glass fiber, and preferably the proportion of the melamine or melamine derivative is 100 parts by weight of the unsaturated polyester resin. On the other hand, an unsaturated polyester resin molding material, which is 0.1 to 20 parts by weight, and a molded product thereof. [Selection figure] None |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114525021-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110527265-A |
priorityDate | 2004-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 36.