| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9d5ebd9bdc11f7a4b267d7e865d5a84f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate |
2005-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3d72fb4603a183a5d43a202b9f7f950 |
| publicationDate |
2005-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2005268826-A |
| titleOfInvention |
Semiconductor element mounting method and display device manufacturing method |
| abstract |
PROBLEM TO BE SOLVED: To provide a method for reducing underfill voids. In a mounting method in which a bump-formed IC and a pattern-formed flexible substrate are mounted face-down, and underfill is injected from the side surface of the IC and cured, bubbles entrained at the time of underfill injection are reduced by heating. It defoams by thermal expansion, and then hardens the underfill. Connection failure due to expansion of bubbles generated by solder reflow is reduced, and stable quality can be realized. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11694990-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11410967-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3772669-A1 |
| priorityDate |
2005-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |