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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20
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filingDate 2004-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a39ef7424ff721b11dda09a52a5f8a1b
publicationDate 2005-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005263872-A
titleOfInvention Epoxy resin composition for semiconductor encapsulation and semiconductor device
abstract PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in adhesion to a substrate, flame retardancy and solder stress resistance without using a bromine-containing organic compound or antimony compound. SOLUTION: (A) An epoxy resin represented by general formula (1), (B) a phenol resin represented by general formula (2), (C) an inorganic filler, (D) a curing accelerator, and (E) An epoxy resin composition for semiconductor encapsulation, characterized in that ethylenethiourea is an essential component and the total inorganic content is 84 wt% or more and 94 wt% or less in the total epoxy resin composition. [Chemical Formula 10] (R1 and R2 are alkyl groups having 1 to 4 carbon atoms, which may be the same or different. A is an integer of 0 to 3, b is an integer of 0 to 4. n is an average value, 1 to 5 positive number.) Embedded image (R1 and R2 are alkyl groups having 1 to 4 carbon atoms, which may be the same or different. A is an integer of 0 to 3, b is an integer of 0 to 4. n is an average value, 1 to 5 positive number.)
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008266647-A
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