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filingDate 2004-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4276cf31a9d2e27afcc95865f73ba7bd
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publicationDate 2005-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005260135-A
titleOfInvention Electronic component manufacturing method and electronic component using the same
abstract When a fine wiring is formed on a substrate, the method using a photosensitive electrode paste increases the product cost because the electrode paste material is expensive, and the ink jet method is expensive because the manufacturing method is special. It is an object of the present invention to provide an inexpensive electronic component manufacturing method and an electronic component using the same that solve the problems and reduce the material cost and the equipment cost. A conductive film in which a conductive material is dispersed in a polymer is formed on a substrate with a predetermined thickness, and a hardener is printed or applied in a predetermined pattern on the conductive film to selectively cure the conductive film. By removing the uncured or soluble portion of the conductor film and forming the predetermined pattern 106 on the substrate, the conductor film can be patterned with a commercially available inexpensive polymer without using an expensive photosensitive electrode material. Furthermore, expensive equipment such as an exposure apparatus is not required, so that material costs and equipment costs can be reduced, and lead time can be shortened, so that inexpensive electronic components can be provided. [Selection] Figure 1
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