| abstract |
【Task】 In the case of mounting at least two sets of power semiconductor modules, it has a cooling structure that can be efficiently cooled under a limited cooling water flow rate and pressure loss, and also a small semiconductor device, a power conversion device using the same, An object of the present invention is to provide a power conversion device three-phase inverter device using the same and a hybrid vehicle equipped with the same. [Solution] Power semiconductor elements 103, 104, 105, 106 are mounted, and first and second power semiconductor modules 101, 102 having a metal base on the bottom surface are provided. The first and second power semiconductor modules 101 and 102 are mounted on both surfaces of the cooling medium flow path. The current supplied to the first power semiconductor module 101 is larger than the current supplied to the second power semiconductor module 102, and the heat dissipation capability of the metal base 107 on the bottom surface of the first power semiconductor module 101 is second. This is larger than the heat dissipation capability of the metal base 109 on the bottom surface of the power semiconductor module 102. [Selection] Figure 1 |