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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
filingDate 2004-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50aebe8bb68da8f858ddb17421506f90
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6d94028092a48be40e701110340b9e91
publicationDate 2005-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005255934-A
titleOfInvention Polyimide resin composition and seamless belt
abstract PROBLEM TO BE SOLVED: To provide a semiconductive polyimide resin composition having a small variation in surface resistance of a polyimide resin composition and hardly causing a decrease in resistance over time, and a seamless belt thereof. SOLUTION: A polyimide resin composition in which a conductive filler is uniformly dispersed in a polyimide resin, and has a volume resistivity of 1 × 10 7 (Ω at an applied voltage of 100 V in an environment of 25 ° C. and 10% humidity. A polyimide resin composition in the range of cm) to 1 × 10 13 (Ω · cm), and a current change characteristic by an applied voltage of 450 V at an arbitrary surface position in the polyimide resin composition is current-time. The exponent part of the approximate expression is −0.2 or more in the power approximate curvature of the plot in the logarithm of. [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101449694-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5441408-B2
priorityDate 2004-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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