| abstract |
【Task】 Compositions and methods with improved selectivity for chemical polishing of silica and silicon nitride for STI processing. [Solution] The present invention is an aqueous composition useful for polishing silica and silicon nitride on a semiconductor wafer comprising 0.01 to 5% by weight of a zwitterionic compound, 0.01 to 5% by weight of a carboxylic acid polymer, an abrasive A zwitterionic compound containing 0.02-6% by weight of grains, 0-5% by weight of a cationic compound and water as the balance, has the following structure Wherein n is an integer, Y is a hydrogen or alkyl group, Z is a carboxyl, sulfate or oxygen, M is a nitrogen, phosphorus or sulfur atom, X 1 , X 2 and X 3 are Independently, a composition comprising a substituent selected from the group consisting of hydrogen, an alkyl group and an aryl group is provided. [Selection figure] None |