http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005247946-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3477
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-04
filingDate 2004-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b71b761e828823b01529002fac412a40
publicationDate 2005-09-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005247946-A
titleOfInvention Phenolic resin molding material for commutators
abstract PROBLEM TO BE SOLVED: To provide copper adhesion while maintaining mechanical strength at a practical level as compared with a conventional phenol resin molding material for a commutator using glass fiber as a main substrate. Provides a phenol resin molding material for a commutator that is difficult to peel off from the resin and is excellent in reducing the level difference between the pieces. The inorganic filler comprises a phenol resin, an inorganic filler, and melamine, wherein the content of the melamine is 0.5 to 4 parts by weight with respect to 100 parts by weight of the phenol resin. Is a phenol resin molding material for a commutator containing glass fiber as the first inorganic filler and at least one selected from clay, calcium carbonate, wollastonite, and talc as the second inorganic filler. . [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111019289-A
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priorityDate 2004-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 21.