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publicationDate 2005-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005243873-A
titleOfInvention Lid and electronic device using the same
abstract PROBLEM TO BE SOLVED: To hold an electronic device that does not pollute the global environment because it does not contain lead even when a heat history of 250 to 260 ° C. is applied when the electronic device is mounted on an external electric circuit or the like. It is providing the cover body and electronic device for packages. SOLUTION: A lid 4 is made of a metal layer 2 made of a nickel-cobalt alloy formed on the entire outer periphery of the lower surface of a plate-like body 1 and tin formed on the entire surface of the metal layer 2. And a solder layer 3 as a main component. [Selection] Figure 1
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