http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005243873-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-10 |
filingDate | 2004-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5a54a96d925d55d9e3cc04346364d4e |
publicationDate | 2005-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2005243873-A |
titleOfInvention | Lid and electronic device using the same |
abstract | PROBLEM TO BE SOLVED: To hold an electronic device that does not pollute the global environment because it does not contain lead even when a heat history of 250 to 260 ° C. is applied when the electronic device is mounted on an external electric circuit or the like. It is providing the cover body and electronic device for packages. SOLUTION: A lid 4 is made of a metal layer 2 made of a nickel-cobalt alloy formed on the entire outer periphery of the lower surface of a plate-like body 1 and tin formed on the entire surface of the metal layer 2. And a solder layer 3 as a main component. [Selection] Figure 1 |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7919908-B2 |
priorityDate | 2004-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.