http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005243767-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24
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filingDate 2004-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22cba8b318e1d5dff5e661db5646fec3
publicationDate 2005-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005243767-A
titleOfInvention Metal-ceramic circuit board and manufacturing method thereof
abstract PROBLEM TO BE SOLVED: To reduce environmental pollution caused by Pb discharge without impairing plating characteristics such as plating adhesion, solder wettability, heat resistance and the like on the surface of a metal circuit board, and its A manufacturing method is provided. In a metal-ceramic circuit board manufacturing method, a metal plate 12 is joined to at least one surface of a ceramic substrate 10 to form a circuit pattern, and then electroless nickel alloy plating is applied to the surface of the metal plate 12. Before the electroless nickel alloy plating 16 is applied, a pretreatment by a zinc replacement method or a palladium activation method is performed, and thereafter, an electroless plating solution containing bismuth and substantially free of lead is used. Electroless nickel alloy plating 16 having an element conversion of 100 ppm or less, preferably 50 ppm or less and a bismuth content of 10 to 800 ppm in terms of element is applied. [Selection] Figure 6
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100698940-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2015114987-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015114987-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011082491-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010500775-A
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