http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005239986-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F283-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3475
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L67-06
filingDate 2004-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_70448c0ba97f46e6ebe02bf42e84ade0
publicationDate 2005-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005239986-A
titleOfInvention Unsaturated polyester resin molding material
abstract PROBLEM TO BE SOLVED: To be an unsaturated polyester used for a molded article having excellent mechanical properties useful for applications of small electronic components, and impairing the excellent electrical characteristics and heat resistance of conventional unsaturated polyester resin molding materials. Thus, there is provided an unsaturated polyester resin molding material capable of imparting weather resistance and having improved mechanical properties. An unsaturated polyester resin molding material comprising an unsaturated polyester resin (a), an inorganic base material (b), and a benzotriazole-based ultraviolet absorber (c), preferably It contains 15 to 30% by weight of unsaturated polyester resin (a), 50 to 80% by weight of inorganic base material (b), and 100 parts by weight of unsaturated polyester resin (a) with respect to the whole molding material. Contains 0.5 to 5 parts by weight of the benzotriazole ultraviolet absorber (c). [Selection figure] None
priorityDate 2004-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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