http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005223097-A

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Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c5520dd38cc403678d9f91e0b0ee95fb
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-41
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52
filingDate 2004-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dab910e1706b8f17092225b33ce3621f
publicationDate 2005-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005223097-A
titleOfInvention Manufacturing method of semiconductor device
abstract A method of manufacturing a semiconductor device in which a back electrode can be appropriately formed without interruption at the edge of a through-hole even when the aspect ratio of the substrate through-hole is large. A method of manufacturing a semiconductor device according to the present invention includes (1) forming a surface electrode 5 on a surface of a substrate 1 and (2) etching the substrate 1 from a portion facing the surface electrode 5 on the back surface of the substrate 1. Thus, a through-hole 7 that penetrates the substrate 1 and reaches the surface electrode 5 is formed, (3) a sidewall titanium film 10 is formed on the sidewall of the through-hole 7, and (4) is electrically connected to the surface electrode 5 Forming a back electrode 13 to be formed on the back surface of the substrate 1 and in the through hole 7. According to the manufacturing method of the present invention, the side wall titanium film 10 with good coverage is formed on the side wall of the through hole 7 and the back electrode 13 is formed on the side wall titanium film 10. However, the back electrode 13 can be appropriately formed without interruption at the edge of the through hole. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019083925-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019083926-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019083927-A
priorityDate 2004-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 21.