| abstract |
The present invention provides UV and / or thermosetting encapsulants used to protect electronic components such as semiconductor devices. Preferably an acrylated / methacrylated or vinylene-containing oligomer / polymer, one or more multifunctional acrylate monomers, and one or more thixotropic agents, and optionally fillers, additives, Encapsulant composition for use in glob top and / or dam and fill applications, including photoinitiators, pigments. The encapsulant has a low level of water absorption and shrinkage. [Selection figure] None |