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filingDate 2003-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1681c386be1c9f2235942c74dddfa463
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publicationDate 2005-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005195690-A
titleOfInvention Metal-containing resin particles, resin particles, and manufacturing method of electronic circuit
abstract A metal-containing resin particle and an electronic circuit manufacturing method capable of forming a metal-containing resin layer with high accuracy are provided. Moreover, the manufacturing method of the resin particle which can form a resin layer with sufficient precision, and an electronic circuit is provided. A surface of a photosensitive drum is charged, an electrostatic latent image having a predetermined pattern is formed on the surface of the charged photosensitive drum, and the surface of the photosensitive drum is formed with the electrostatic latent image. , A metal-containing resin particle 2a comprising 50% by weight or more of a thermosetting resin and having a moisture absorption of 500 to 14500 ppm and metal fine particles contained in the resin, or 50% by weight or more of thermosetting Resin particles 4a containing resin and having a moisture absorption of 500 to 14500 ppm are electrostatically attached to form a visible image, and the metal-containing resin particles 2a formed on the surface of the photosensitive drum 11 or The visible image composed of the resin particles 4 a is transferred onto the substrate 1, and the visible image transferred onto the substrate 1 is fixed on the substrate 1. [Selection] Figure 5
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