http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005194569-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_40a562ada2a4ad540fd037a6bef7ee0f |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-44 |
| filingDate | 2004-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7902d2086dfe885ae13b1e993e6f3e6d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1dc11f910c1d31d9bfb7ce6a1b6d025 |
| publicationDate | 2005-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2005194569-A |
| titleOfInvention | Electroless gold plating solution |
| abstract | PROBLEM TO BE SOLVED: To have a gold deposition rate of 0.4 μm or more per hour at 60 ° C., preferably 0.5 to 1.2 μm, excellent stability as a plating solution, and good electroless continuously for a long period of time. Provided is a plating solution which can be gold-plated and does not place a burden on the environment. An electroless gold plating solution containing a gold salt, a complexing agent, a reducing agent, and at least one selected from glycolic acid, diglycolic acid and salts thereof, wherein the water-soluble polyaminocarboxylic acid is used as the complexing agent. An electroless gold plating solution containing an acid and / or a salt thereof and having a content of 50 g / L or less is used. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008266712-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010255010-A |
| priorityDate | 2004-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 101.