http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005191390-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-318
filingDate 2003-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5dbdfade472d09ea09a83ce49e3c9fa8
publicationDate 2005-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005191390-A
titleOfInvention Manufacturing method of semiconductor layer
abstract PROBLEM TO BE SOLVED To provide a semiconductor layer manufacturing method capable of obtaining a semiconductor layer having a high crystallization rate with respect to a substrate in order to solve the above problems. A semiconductor layer is formed on a surface of a base material after exposing the base material to plasma of nitrogen gas under a pressure near atmospheric pressure. A semiconductor layer having a high crystallization rate can be obtained by exposing the base material 90 to plasma nitrogen gas before forming the semiconductor layer on the surface of the base material 90. [Selection] Figure 1
priorityDate 2003-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 20.