http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005189110-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N25-72
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filingDate 2003-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e97d14c5a57c9f3cc1543c7df35f80f8
publicationDate 2005-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005189110-A
titleOfInvention Soldering inspection apparatus and inspection method thereof
abstract PROBLEM TO BE SOLVED: To downsize a soldering inspection apparatus as a whole without adversely affecting a device to be inspected when inspecting a good / defective bonding state of a solder joint portion of an electronic device or the like, Furthermore, it aims at providing the soldering inspection apparatus which can reduce the installation cost of a soldering inspection apparatus, and its inspection method. A cooling step of blowing a cooling gas onto a solder joint portion, a measuring step of measuring a temperature of the solder joint portion sprayed with the cooling gas, and the solder joint portion based on the measured temperature of the solder joint portion A soldering inspection and a soldering inspection method, comprising: a determination step of determining whether the bonding state is good or defective. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102918384-A
priorityDate 2003-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 18.