| abstract |
PROBLEM TO BE SOLVED: To provide a resin composition, a carrier material with a resin, and a multilayer printed wiring board that can easily and reliably melt solder bumps and perform electrical bonding between circuit board layers. . SOLUTION: A compound having a carboxyl group and a phenolic hydroxyl group, an inorganic filler having an average particle size of 0.1 to 1 μm, and a synthetic rubber modified with a carboxyl group, and the carboxyl group and the phenolic hydroxyl group. The compound having a group is a polyhydric phenol, the compound having a carboxyl group and a phenolic hydroxyl group is 5 to 25% by weight of the resin solid content, and further a resin composition containing an epoxy resin. [Selection] Figure 4 |