http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005171106-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7ef01e33058cf740cf2197991be97af1 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L35-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F283-04 |
| filingDate | 2003-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_13435da176ad4cfe490ce68be19c06d8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c1dc2adfda73524f39df6a947705c27f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f92af05eb56d6c72172e2f604b077d39 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7e9a60529fb3371159ca86d39ddf955 |
| publicationDate | 2005-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2005171106-A |
| titleOfInvention | Resin composition and metal laminate |
| abstract | The present invention provides a heat-resistant resin composition that maintains excellent low-temperature adhesion without undergoing thermosetting even after a high-temperature process, and a polyimide metal laminate excellent in low-temperature workability even after undergoing a high-temperature process. A polyamic acid and / or a polyimide has a general formula (1). [Chemical 1] (In the formula, m represents an integer of 1 or more, X may be the same or different each independently, and may be a hydrocarbon group, an ester group, an amide group, O, CO, SO2, S, C (CF3 ) 2 or direct bond, R1 is the same or different, and represents a hydrogen atom, a halogen atom, a hydroxyl group, or a hydrocarbon group, and the substitution positions are independent of each other. A resin composition obtained by blending a bismaleimide compound having a peak of an exothermic peak of 300 ° C. or higher, and a metal laminate in which the resin composition is laminated on at least one surface of a metal foil. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008010514-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5293182-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008254352-A |
| priorityDate | 2003-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 105.