http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005167016-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7ef01e33058cf740cf2197991be97af1 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 |
filingDate | 2003-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_077552f5303766f4c65340dab8ac58ed http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a82fd19b3e89d3a3590c0467d1a78580 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_887c02ee12d0d7f5da3f388d3e9c9c9c |
publicationDate | 2005-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2005167016-A |
titleOfInvention | Slurry for polishing |
abstract | 【Task】 Provided is a polishing slurry used in the manufacture of a semiconductor device having copper, which can remarkably suppress the occurrence of corrosion, scratching, dishing and erosion of a metal surface even when the polishing rate is increased. [Solution] The polishing slurry is a polishing slurry used for manufacturing a semiconductor device having copper, and has a metal impurity content of 1 ppm or less, a metal impurity content of 1 ppm or less, and a sulfur component content of less than 5% by weight. It contains organic particles polymerized by a polymerization initiator and water. The organic particles are composed of a copolymer obtained by emulsion polymerization of 1 to 50% by weight of vinyl monomers and 99 to 50% by weight of other vinyl monomers based on the weight of all monomers. It is preferable that it contains a complexing agent and an oxidizing agent. [Selection figure] None |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008016677-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8900335-B2 |
priorityDate | 2003-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 102.