| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-688
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate |
2003-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7e933bb4657cb10fe4111b816e229d0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06fa786214dc7c4520b67a8be765723c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9fc501514ccf468bcfa4aa7db86dd8d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_43865c420f84df6cbbea8f7b0d053979
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_66463f1f0fad324beec90327fb574cab
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_096e79fe344855559ec13ac6997d4bbe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b3a3c8b972120fefdae22445236dff1f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0897a7dfd33184205cf54969c6f8bc07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_709038b8bb2d97bf6a5b66771e6eb6b3 |
| publicationDate |
2005-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2005162942-A |
| titleOfInvention |
Method for producing epoxy resin composition for semiconductor encapsulation, epoxy resin composition for semiconductor encapsulation, and semiconductor device obtained thereby |
| abstract |
The present invention provides a method for producing an epoxy resin composition for semiconductor encapsulation excellent in reliability without generation of voids or the like. A method for producing an epoxy resin composition for semiconductor encapsulation containing the following components (A) to (C). First, among the blending components containing the following components (A) to (C), all or a part of the blending components excluding the component (A) is preliminarily reduced in pressure from 1.333 to 66.65 kPa, and 100 to Premix under heating conditions of 230 ° C. Next, an epoxy resin composition for semiconductor encapsulation is produced by blending and mixing the following component (A) and the remaining component in this preliminary mixture. (A) Epoxy resin. (B) Phenolic resin. (C) A curing accelerator. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007077291-A |
| priorityDate |
2003-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |