| abstract |
PROBLEM TO BE SOLVED: To provide an optical element connection structure and an IC chip mounting substrate capable of shortening a wiring length and improving connection reliability. An electrode 12d of a light receiving element 12 is formed in a rectangular shape, and an electrode 14d of a receiver IC 14 is formed in a rectangular shape. Therefore, even if second bonding is performed on the electrode 14d, the capillary is not displaced from the electrode 14d. Can be done. Thereby, connection reliability can be improved. Further, since the light receiving element 12 and the receiver IC 14 are electrically connected by wire bonding, the wiring length between the light receiving element 12 and the receiver IC 14 can be shortened. [Selection] FIG. |