| abstract |
A light-emitting semiconductor device in which a light-emitting semiconductor element and a substrate are bonded using a silicone resin composition as a die bond material is sealed with a cured product of an epoxy / silicone hybrid resin composition. Light emitting semiconductor device. [Effect] According to the present invention, there is provided a light emitting semiconductor device in which a light emitting semiconductor element can be firmly bonded to a substrate, an internal stress of a sealing material is small, light transmittance is excellent, and cracks and lead removal are unlikely to occur. can do. [Selection] Figure 1 |