http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005157115-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B6-122 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate | 2003-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_77afbde0c23cec6743732aa0473f2413 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c979eb7385c9cec24764a16d3497a2d |
| publicationDate | 2005-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2005157115-A |
| titleOfInvention | IC chip mounting substrate, motherboard substrate, optical communication device, IC chip mounting substrate manufacturing method, and motherboard substrate manufacturing method |
| abstract | PROBLEM TO BE SOLVED: To provide an IC chip mounting substrate on which an optical element is mounted and an optical signal passage region is provided and which has excellent connection reliability. An IC chip mounting substrate in which a conductor circuit and an interlayer resin insulating layer are laminated on both surfaces of a substrate, a solder resist layer is formed on the outermost layer, and an optical element is mounted. An optical path for optical signal transmission is formed at least in the interlayer resin insulation layer and the solder resist layer, and a portion other than the portion penetrating the solder resist layer of the optical path for optical signal transmission is filled with a resin composition. And An IC chip mounting board characterized in that, in the optical path for optical signal transmission, the diameter of the cross section of the portion penetrating the solder resist layer is smaller than the diameter of the cross section of the portion formed in the interlayer resin insulation layer . [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013222095-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007111327-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011060892-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5244585-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013105025-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015106568-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101099582-B1 |
| priorityDate | 2003-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 63.