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filingDate 2003-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_655f5fd2bb9b4e43a3f622f2ee0d4628
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publicationDate 2005-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005154880-A
titleOfInvention Polyimide precursor metal complex solution, base material for electronic parts using the same, and method for producing the same
abstract PROBLEM TO BE SOLVED: To form a polymer metal complex by reacting a polyimide precursor solution with a palladium salt or a palladium organic carbonyl complex at room temperature. Further, in this polymer metal complex, palladium ions in the complex are hydrogen donors. It was found that the polymer metal complex had photosensitivity that it was reduced to palladium metal by ultraviolet irradiation in the presence of. However, this polyimide precursor metal complex solution containing palladium ions has a problem that the viscosity of the solution changes (increases) with the lapse of time during storage, and uniform coating cannot be performed. SOLUTION: Since the increase in viscosity and gelation of a palladium ion-containing polyimide precursor metal solution can be suppressed over a long period of time, it is not necessary to prepare liquids or manage the viscosity of the liquid on site, and the liquid can be easily managed. [Selection] [Figure 1]
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