| abstract |
PROBLEM TO BE SOLVED: To provide an adhesive composition excellent in heat resistance, crack resistance, adhesion, and seepage resistance with little bleeding, an adhesive member using the same, a semiconductor mounting support member, and a semiconductor device. An adhesive composition comprising (1) an epoxy resin, (2) a high molecular weight component having a functional group-containing weight average molecular weight of 100,000 or more, and (3) an imidazole compound, The adhesive composition is compatible with the high molecular weight component before the epoxy resin is cured, and forms a sea-island structure by phase separation with the high molecular weight component after the epoxy resin is cured. An adhesive composition having a size of 5 to 1000 nm. [Selection] Figure 1 |