| abstract |
PROBLEM TO BE SOLVED: To realize an interconnector (IC) structure in which cracks and peeling hardly occur in a horizontal stripe cylindrical SOFC, and to extend the life of the SOFC. Reduction of cell connection resistance. SOLUTION: A porous metal IC film 2 is formed on a substrate tube 1, and a fuel electrode 3 and a dense metal IC film 4 are formed so as to cover a part thereof. A solid electrolyte film 5 is formed on the fuel electrode 3 and the dense metal IC film 4 so as to cover the fuel electrode 3 and cover the periphery of the dense metal IC film 4. An air electrode 6 is formed on the solid electrolyte film 5 so as to cover a part thereof, and a porous metal IC film 7 is formed thereon so as to cover the air electrode 6 and to cover the exposed portion of the dense metal IC film 4. To do. An anti-peeling film 8 is formed on the cut portion of the porous metal IC film 7 so as to cover the dense metal IC film 4. [Selection] Figure 1 |