http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005149898-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6572309f22e2ad56c1390a78ac237bed
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R11-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R43-00
filingDate 2003-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cfba63a0ecae1edbd7886ee78ad7f7ba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cfb97bfecfb0a1f0a5435afaf0c962d5
publicationDate 2005-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005149898-A
titleOfInvention Heat seal connector and manufacturing method thereof
abstract PROBLEM TO BE SOLVED: To provide a heat seal connector capable of suppressing the occurrence of fine cracks in a fine pitch conductive pattern and a manufacturing method thereof. A conductive pattern in which a plurality of conductive lines are arranged at a fine pitch by screen-printing a conductive paste on the coating layer and a coating layer formed on the substrate to be printed. 21. Then, the coating layer 10 is formed to a thickness of 0.1 to 2.8 μm so as to absorb the solvent component of the conductive paste 20, and the viscosity of the conductive paste 20 is set to 200 to 500 mPas. The degree of change is in the range of 5 to 8 (viscosity at 2 rpm) / (viscosity at 20 rpm), and a plurality of electrical junctions are connected electrically. Since the coating layer 10 is made thin and the fluctuation degree of the conductive paste 20 is set high, it is possible to suppress the occurrence of fine cracks that cannot be visually grasped in the fine pitch conductive lines 22. [Selection] Figure 2
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011150836-A
priorityDate 2003-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414875457
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID155116
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414862845
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID423443469
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419522923
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID412495863
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID10989
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID451296148
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7822
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14311
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414867529
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID411326070
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID426025815
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7406
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8054
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419554492
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID410492784
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID9543286
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID426145961
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8160
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID12348
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8034
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID4275592
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID54048897
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8210
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419524931
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID21903822
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID408510678
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414862891
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7958

Total number of triples: 44.