Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6b822ee046eb6c45d1e3bd9ce9c1782e |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-786 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G09F9-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-1368 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-336 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522 |
filingDate |
2004-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b7586db3f00832e26eb1ef6c192d9f4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e08f18ae9dce170a0868c386e97a8e17 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_355ecd938d5db8a8c46af3ef5a4c4e11 |
publicationDate |
2005-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2005148728-A |
titleOfInvention |
Integrated circuit |
abstract |
PROBLEM TO BE SOLVED: To improve the reliability of an integrated circuit. A semiconductor film formed on a substrate; a first insulating film formed on the semiconductor film having a through hole; and the first insulating film connected to the semiconductor film through the through hole. An integrated circuit having a wiring formed on the film, a passivation film formed on the wiring, and a second insulating film formed on and in contact with the passivation film and including a siloxane structure. The problem is solved. [Selection] Figure 9 |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7459351-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007052390-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018051685-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11253856-B2 |
priorityDate |
2000-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |