| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6fc8bbba7dbfdc1fe42f350fc84e17a3 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-44 |
| filingDate |
2004-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d7f0f8ee6f9b4d7a8edfbdd1597246bb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8c315662ec7736ba1486e09b1cac6f4a |
| publicationDate |
2005-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2005146410-A |
| titleOfInvention |
Electroless gold plating solution |
| abstract |
【task to solve】 In the cyan electroless gold plating solution, the high temperature and strong alkali conditions, which are the conventional problems, are eliminated, and a plating solution that can be used for semiconductor materials with positive photoresist is provided. A practical electroless gold plating solution capable of increasing the thickness of the gold film is provided. [Solution] An electroless gold plating solution comprising a cyanide compound and ascorbic acid or a derivative thereof, the electroless gold plating solution comprising one or more precipitation accelerators selected from the group consisting of a copper compound, a thallium compound and a lead compound. Electrolytic gold plating solution. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018122989-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112144045-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007023324-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2018122989-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101768927-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110114507-A |
| priorityDate |
2003-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |