| abstract |
PROBLEM TO BE SOLVED: To provide a cleaning liquid for an integrated circuit element formed on a wafer to be cleaned and a cleaning method using the cleaning liquid. An integrated circuit element cleaning liquid comprising a low-bubble surfactant, a metal corrosion inhibitor, an acidic pH adjusting agent or an alkaline pH adjusting agent, and water. Accordingly, when a metal material such as tungsten is introduced into the gate line manufacturing process, the cleaning liquid according to the present invention can be used in the cleaning process for particle removal performed after the gate line pattern is formed. [Selection] Figure 1 |