http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005139512-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_81e0309390dc9804fa5eceb758f58230
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-48
filingDate 2003-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_18a61f24030ec2f9557bf8a847952d9e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ee2871aa03f5e79471918e7a474ebd92
publicationDate 2005-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005139512-A
titleOfInvention Electroless Pd-Ag alloy plating
abstract PROBLEM TO BE SOLVED: To provide a chelating agent having an appropriate chelating power for both palladium and silver in an electroless palladium-silver alloy plating bath and increasing the number of usable reducing agents. An electroless palladium-silver alloy plating bath includes a palladium salt, a silver salt, a reducing agent, a chelating agent, and a pH adjusting agent. The chelating agent is an organic sulfur compound. Examples are thioglycolic acid, thiodiglycolic acid, thiomalic acid, and methanesulfonic acid. The reducing agent is a weak reducing agent having a weak reducing power. Used for reducing sugars such as glucose, sucrose, fructose, sodium and potassium salts of low molecular weight aldehydes such as sodium formate, sodium hypophosphite, potassium hypophosphite, sodium phosphite, hydrazine and hydrazine hydrate Is possible.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101617654-B1
priorityDate 2003-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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