http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005136440-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_75d7fcd77f12cd9a6e6f91d2ac995ac5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36d1d9c59848bff6ad5f55923d1290f5 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29L31-34 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate | 2005-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8929efb6379b6e2e6a3388f8dc3f9f29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c8e73aba84c74d5ecdd7e3a252389d88 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1035a94d1a16f6565fe81d29445685f2 |
| publicationDate | 2005-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2005136440-A |
| titleOfInvention | Manufacturing method of semiconductor device |
| abstract | PROBLEM TO BE SOLVED To improve yield of products by reducing mold defects in a mold using a film. Before placing a chip assembly in a cavity 12a, a mold 10 is clamped empty, and a resin filling portion 10a formed by the empty clamp is sealed by an O-ring 34. By sucking the film 8 and the lower film 9 and placing the films along the inner surfaces of the cavities 11a and 12a, and then performing mold molding by placing the chip assembly in the cavity 12a and performing mold clamping, respectively. Since the mold resin can be filled in the state in which the film is placed along the inner surfaces of the cavities 11a and 12a, the upper film 8 can be prevented from sagging and the lower film 9 can be prevented from rising, and the upper film 8 can be brought into contact with the bonding wire. Wire breakage can be prevented. [Selection] Figure 9 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011100766-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008272959-A |
| priorityDate | 2005-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419881454 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID12243 |
Total number of triples: 20.