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filingDate 2004-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aff0bb93c6b0ff0b2e00f58795979679
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publicationDate 2005-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005136403-A
titleOfInvention Method for manufacturing thin film transistor
abstract PROBLEM TO BE SOLVED: To provide a method for manufacturing a thin film transistor and a method for manufacturing a semiconductor device, in which the manufacturing process is shortened and the manufacturing cost is reduced without using a peeling process. The method includes forming a mask in contact with a first conductive layer, etching the first conductive layer using the mask to form a second conductive layer, and the mask includes droplets. It is formed by a discharge method and is not further removed. Note that the first conductive layer is formed over the entire surface by a sputtering method, an evaporation method, a droplet discharge method, or the like, or formed in part by a droplet discharge method. In addition, as an essential constituent element of the present invention, an insulating layer used as a mask is formed by a droplet discharge method, but an insulating layer formed by a droplet discharge method is used as a mask as it is or a droplet is discharged. Either of the methods is employed, in which an insulating layer that has been subjected to exposure processing and development processing is used as a mask for the insulating layer formed by a discharge method. [Selection] Figure 1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012164876-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020005006-A
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Total number of triples: 48.