http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005132888-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-66 |
| filingDate | 2003-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3a9da31b49e429237329ce52da6fa25 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7cc1048f6c2ad9ec0be2ecca9d3c885 |
| publicationDate | 2005-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2005132888-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To provide an epoxy resin composition having high adhesion strength to a lead frame and excellent in solder resistance, and a semiconductor device. It includes (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler, and (E) 2-amino-4,6-mercapto-s-triazine. Semiconductor sealing epoxy resin composition, more preferably a semiconductor encapsulation containing the 2-amino-4,6-mercapto-s-triazine in a proportion of 0.004 to 2% by weight based on the resin composition. Stopping epoxy resin composition, and semiconductor device using these to seal a semiconductor element. |
| priorityDate | 2003-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.