| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4edd4e526605dbd18b513b4b30d19ab2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-30107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48465
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48237
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49833
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 |
| filingDate |
2004-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b6cac4e8c0bc1b0cab79abac63ef6ba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b7572fb62567d0428699a3d6e3c1616
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_858b48a81e541c5d8342083fecc23435
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_088ec23d4b0dcf6e0881472449a3d135 |
| publicationDate |
2005-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2005129904-A |
| titleOfInvention |
Semiconductor device and manufacturing method thereof |
| abstract |
To improve heat dissipation and high frequency characteristics of a semiconductor device. A semiconductor device includes a first conductive film and a second conductive film provided on both surfaces of an insulating resin film. A circuit element 120 is placed on the second conductive film 104, and the circuit element 120 is electrically connected to the second conductive film 104. The second conductive film 104 is provided so as to cover the via plug 110. The via plug 110 is formed in a tapered shape whose diameter decreases in the direction from the first conductive film 102 to the second conductive film 104. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011228737-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010258062-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7553164-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016076594-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012084573-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8455770-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9155195-B2 |
| priorityDate |
2003-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |