http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005127961-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9ec030fc062b270c25327af9127bed3a |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R33-76 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate | 2003-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eec0d57619b265a2d410abd10d021ad7 |
| publicationDate | 2005-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2005127961-A |
| titleOfInvention | Test board and test apparatus using the same |
| abstract | PROBLEM TO BE SOLVED: To provide a test substrate for inspecting a semiconductor package or a chip, which has a simple structure, a low manufacturing cost, and can cope with an increase in the number of pins. SOLUTION: A plurality of insulating substrates (10) and a plurality of protrusions having thin protrusions at the tips, which are formed by wire bonding on one surface of the insulating substrate and are arranged corresponding to the arrangement of bumps or terminals (14) to be inspected. Ball bump (16), a plurality of microsprings (22) arranged on the other surface of the insulating substrate, and from one surface of the insulating substrate to the other surface to electrically connect each ball bump and microspring. And a conductive via (24) penetrating therethrough. [Selection] Figure 2 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008243459-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4494429-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008533441-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007080592-A |
| priorityDate | 2003-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541 |
Total number of triples: 18.