http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005125688-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate | 2003-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a830ffb40d96d60483e987df0222c8d5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b397ffb732faf17b6cd7ad96a641c662 |
| publicationDate | 2005-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2005125688-A |
| titleOfInvention | Laminated film with metal layer, semiconductor device using the same, and method for producing laminated film with metal layer |
| abstract | The present invention relates to a laminated film with a metal layer that can be thermocompression-bonded at a low temperature, has a small decrease in adhesive strength after heat load and after a heat and humidity resistance test, and does not break when bonding an IC under gold-tin eutectic conditions, and reliability A semiconductor device with high performance is provided. In a laminated film with a metal layer in which a metal layer is laminated on at least one surface of a heat resistant insulating film via a heat resistant resin layer, the heat resistant resin layer is on the metal layer side (a) elasticity at 300 ° C. (B) Laminated film with a metal layer comprising at least two layers having an elastic modulus at 300 ° C. of 0.1 to 100 MPa on the heat-resistant insulating film side, and a semiconductor device using the laminated film I will provide a. Moreover, as a manufacturing method of this laminated | multilayer film, (A) The process of applying and laminating a heat resistant resin to a heat resistant insulating film, (B) The process of applying and laminating a heat resistant resin on metal foil, (C) (A) The manufacturing method of the laminated | multilayer film with a metal layer which consists of the process of heat-pressing the laminated body of (B) centering on a heat resistant resin layer. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007035869-A |
| priorityDate | 2003-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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