| abstract |
PROBLEM TO BE SOLVED: To provide a curable resin composition having good moldability, and a cured product obtained has low dielectric properties, high heat resistance, and excellent heat resistance after moisture absorption. SOLUTION: A curable resin composition comprising 1 to 30 parts by weight of a crosslinked polystyrene (b) powder as an essential component with respect to 100 parts by weight of a cyanate ester resin (a), preferably the curable resin composition A curable resin composition comprising a polyphenylene ether resin (c) having a weight average molecular weight of 500 to 3000 and / or a polycarbonate resin (d) and / or silica powder (e). The cured product of the curable resin composition has a low dielectric property and high heat resistance, and a laminated material excellent in moldability and heat resistance after moisture absorption was obtained in printed wiring board applications. |