| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_75ab5a6f35d53e52e4daf5ff6e5932b3 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0093 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-64
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62 |
| filingDate |
2004-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ff66dd35c9ac87958a4c708dddcd4f38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c521373f8bf861457a9fe9286bf4fea |
| publicationDate |
2005-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2005117015-A |
| titleOfInvention |
Manufacturing method of light emitting diode and structure of the light emitting diode |
| abstract |
PROBLEM TO BE SOLVED: To provide a light emitting diode having good heat dissipation characteristics. The present invention relates to a method of manufacturing a light emitting diode and a structure of the light emitting diode. In this manufacturing method, a step of supplying a growth substrate, a step of growing a semiconductor chip on the growth substrate, a step of bonding a metal substrate and the semiconductor chip, and a step of removing the growth substrate thereafter, Forming one electrode and a second electrode under the semiconductor chip and on the metal substrate, respectively. [Selection] Figure 4 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007032421-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7786489-B2 |
| priorityDate |
2003-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |