http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005116797-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24461d63db51630fb1930da1e2710b92
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H9-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H9-02
filingDate 2003-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c3483ca4bd9e98739f29a0de16fc2ca
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publicationDate 2005-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005116797-A
titleOfInvention Electronic component package and piezoelectric vibration device using the package
abstract An object of the present invention is to ensure the reliability of hermetic sealing and bonding between a package base and a cap, and to have a hermetic sealing configuration that also copes with environmental problems, and further reduces manufacturing costs. A crystal resonator A hermetically seals a crystal diaphragm 1, a package substrate 2 on which the crystal resonator plate 1 is mounted, and the crystal resonator plate 1 which is bonded to the package substrate 2 and mounted on the package substrate 2. And a cap 3 for the purpose. The package base 2 is composed of a bottom surface portion 21 and a ceramic frame portion 22 provided on the outer periphery of the bottom surface portion 21, and a glass layer 41 is formed on an end surface 221 of the frame portion 22. A glass material 42 is formed on the lower surface of the cap 3. The glass layer 41 and the glass material 42 are composed of a lead-free and halogen-free bismuth-based material, and are melted by heating them to a predetermined temperature. The cap 3 is hermetically joined. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108933577-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007274071-A
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priorityDate 2003-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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