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filingDate 2003-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_04417a7077d1ca51bf59f76e3d2897f4
publicationDate 2005-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005116560-A
titleOfInvention Semiconductor device, circuit board, and electro-optical device
abstract PROBLEM TO BE SOLVED: To ensure the accuracy of arrangement position at the time of mounting and to improve the strength of a joint portion against a temperature cycle applied after mounting. An electrode 101 electrically connected to a conductive layer to be mounted, a structure 102 protruding from the electrode 101 and formed in a predetermined pattern with a resin, and a structure electrically connected to the electrode 101 And a conductive layer 103b reaching 102. The structure 102 is provided with a convex portion or a concave portion 106 corresponding to the concave portion or the convex portion to be mounted, and a conductive layer 103b electrically connected to the electrode 101 is provided on the upper surface using a fluid material. . There are damming portions 111 and 112 that dam the flow of the fluid material at a predetermined position. [Selection] Figure 4
priorityDate 2003-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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